Current Situation and Development Trend of Core Process Equipment Technologies for Integrated Circuit

doi:10.3981/j.issn.2097-0781.2022.03.005

Science and Technology Foresight ›› 2022, Vol. 1 ›› Issue (3): 61-72.DOI: 10.3981/j.issn.2097-0781.2022.03.005

• Review and Commentary • Previous Articles Next Articles

Current Situation and Development Trend of Core Process Equipment Technologies for Integrated Circuit

ZHAO Jinrong(), WEI Gang, HOU Jue, CAO Yongyou, DONG Jinwei, LU Xisheng, SUN Wei

Beijing NAURA Microelectronics Equipment Co., Ltd., Beijing 100176, China

Received:2022-06-16 Revised:2022-08-26 Online:2022-09-20 Published:2022-11-04

集成电路核心工艺装备技术的现状与展望

赵晋荣(), 韦刚, 侯珏, 曹永友, 董金卫, 卢夕生, 孙伟

北京北方华创微电子装备有限公司,北京 100176

作者简介:赵晋荣,教授级高级工程师。现任北方华创科技集团股份有限公司/北京北方华创微电子装备有限公司董事长、CEO。长期致力于高端集成电路设备开发及产业化应用。作为项目负责人多次主持国家科技重大专项02专项和国家“863”计划,从无到有,从有到优,自主研制多代刻蚀、PVD、CVD等装备。入选“国家百千万人才工程”“北京学者计划”等。获国家科学技术进步奖二等奖、北京市科学技术奖一等奖等。电子信箱： zhaojinrong@naura.com。

Abstract

Abstract:

Integrated circuit (IC) equipment is essential in the industrial chain of IC, the industry of which features high technical thresholds. This paper analyzes its industry development status both at home and abroad, the development trends of its core process equipment technologies, and the challenges faced by technologies of its key matching parts. On this basis, the problems and pain points of China’s IC equipment industry are explored to predict the development trends of the industry and its technologies. Finally, measures and suggestions are proposed for the development of China’s IC equipment industry under this background.

Key words: integrated circuit, equipment fabrication industry, core process equipment

摘要：

集成电路装备产业是集成电路产业链的重要组成部分,拥有极高的技术门槛。文章从分析国内外集成电路装备产业的发展现状、核心工艺装备技术的发展趋势及配套关键部件技术面临的挑战等方面入手,剖析中国集成电路装备产业的问题与痛点,探求产业和技术的发展趋势,进而对中国集成电路装备产业在此背景下的发展提出对策与建议。

关键词: 集成电路, 装备制造业, 核心工艺装备

ZHAO Jinrong, WEI Gang, HOU Jue, CAO Yongyou, DONG Jinwei, LU Xisheng, SUN Wei. Current Situation and Development Trend of Core Process Equipment Technologies for Integrated Circuit[J]. Science and Technology Foresight, 2022, 1(3): 61-72.

赵晋荣, 韦刚, 侯珏, 曹永友, 董金卫, 卢夕生, 孙伟. 集成电路核心工艺装备技术的现状与展望[J]. 前瞻科技, 2022, 1(3): 61-72.

Figures/Tables 5

References 25

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总排名	装备厂商
1	应用材料（AMAT）
2	阿斯麦（ASML）
3	东电电子（TEL）
4	泛林半导体（LAM）
5	科磊半导体（KLA）
6	细美事（SEMES）
7	迪恩士（DNS）
8	科意半导体（KE）
9	先晶半导体（ASM）
10	村田机械（Murata）

总排名	装备厂商
1	应用材料（AMAT）
2	阿斯麦（ASML）
3	东电电子（TEL）
4	泛林半导体（LAM）
5	科磊半导体（KLA）
6	细美事（SEMES）
7	迪恩士（DNS）
8	科意半导体（KE）
9	先晶半导体（ASM）
10	村田机械（Murata）

	厂商	主营品类
	大和集团	精密金属、陶瓷、石英、硅
	沈阳富创	精密金属
	肯发高精	精密金属
	昆山新莱	精密金属、阀门管件
	靖江先锋	精密金属
	苏州珂玛	陶瓷
	沈阳贺利氏	石英
	七星流量计	质量流量计
	托伦斯	精密金属
	沈阳新松	半导体设备前端模块、机械手

	厂商	主营品类
	大和集团	精密金属、陶瓷、石英、硅
	沈阳富创	精密金属
	肯发高精	精密金属
	昆山新莱	精密金属、阀门管件
	靖江先锋	精密金属
	苏州珂玛	陶瓷
	沈阳贺利氏	石英
	七星流量计	质量流量计
	托伦斯	精密金属
	沈阳新松	半导体设备前端模块、机械手

Current Situation and Development Trend of Core Process Equipment Technologies for Integrated Circuit

集成电路核心工艺装备技术的现状与展望

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References 25

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