Marine economy has become one of the important pillars of global economic development. However, the high temperature, humidity, salt mist, and intense radiation in the South China Sea cause severe corrosion of marine engineering materials and equipment in service. Titanium alloys, with their low density, high specific strength, and excellent corrosion resistance, are the preferred materials for marine engineering equipment. However, the high application costs severely restrict their widespread application. Reducing the application costs of titanium in marine environments has become a key focus for the development of marine titanium alloys. This article reviewed the progress of low-cost titanium applications both in China and abroad, focusing on two aspects of low-cost extraction and reduced usage of titanium. It analyzed three low-cost titanium extraction technologies: the FFC process, the OS process, and the USTB process. The article also outlined three approaches for reducing titanium usage: titanium-steel thermomechanical composites, high-energy beam preparation of titanium alloy coatings, and titanium-steel ultrasonic composites. It envisioned a development model for the large-scale and low-cost application of marine titanium alloys and offered targeted suggestions for advancing basic research, conducting product application studies, strengthening talent cultivation and recruitment, and enhancing industry, university, and research collaboration and technology transfer, so as to promote the overall enhancement and high-quality development of China’s marine titanium alloy industry.

Since the beginning of the 21st century, lunar exploration activities have gradually evolved from “understanding” to “understanding & utilization”. This paper analyzes the international development trends in lunar resource utilization. In the field of in-situ lunar resource utilization, spacefaring nations like the United States have not yet established an absolute leadership position. From the perspective of supporting the sustainable construction and efficient operation of lunar research stations, this paper gives the modes of in-situ resource utilization activities, such as energy acquisition and utilization, mineral extraction and conversion, and lunar base construction and operation, and it classifies high-value utilization methods. The paper summarizes the key scientific and technological challenges of in-situ lunar resource utilization, outlines short-term, mid-term, and long-term development goals for lunar resource utilization, and presents relevant strategic recommendations. The research findings in this paper can provide valuable references for the demonstration of national initiatives and the implementation of specific innovation research in various disciplines.

The development of the internet of things (IoT), edge computing, mobile internet, and artificial intelligence (AI) has greatly enriched human-centered sensing and computing scenarios. Human-centered sensing and computing regard people as the subject or participant of sense and consciously or unconsciously combine human intelligence in the sensing and computing process, which can thus improve model adaptability and protect humans from the risks of AI. This paper discusses the concept of human-centered sensing and computing and summarizes the corresponding research works and typical applications from different aspects. Then, the paper points out a series of major challenges and research problems and finally proposes prospects for human-centered sensing and computing research on human-machine collaborating ways and ethics.

Advanced packaging technology, whose drive has evolved from high-end smartphones to high-performance computing and artificial intelligence (AI), mainly involves high-performance processors, memories, and AI training and inference. As the development of integrated circuits is constrained by the memory, area, power consumption, and function, the advanced packaging technology with chiplet heterogeneous integration at its core will be the key path and breakthrough for the development of integrated circuits. This paper reviews some advanced packaging technologies of milestone significance worldwide and presents the development status and advantages of advanced packaging in China. After that, it analyzes the gap between China and the world’s advanced level and put forward some suggestions for the development of China’s advanced packaging technology.