Logic and memory technologies of integrated circuits (ICs) cannot be updated simply by plane scaling in the post-Moore era, and three dimensions (or 3D) have become a promising development direction. This paper discussed the development of technologies that have attracted wide attention from industries in the post-Moore era and are highly compatible with the existing IC industrial technologies and ecology in terms of logic, memory, and 3D integration. Furthermore, the paper analyzed the advantages and challenges of various technologies and tried to give suggestions on China’s research and development in this regard. In addition, in terms of logic technology, the paper started from the device development to expound on the current mainstream FinFET in mass production and gate-all-around nanodevices to be mass-produced and then introduced Forksheet and CFET devices. In terms of memory technology, the paper analyzed several memory devices, which include six different memorizers that are or are to be mass-produced. Finally, in terms of 3D integration, the paper described three popular technologies including 3D stacking, Chiplet, and large chips.