Advanced packaging technology, whose drive has evolved from high-end smartphones to high-performance computing and artificial intelligence (AI), mainly involves high-performance processors, memories, and AI training and inference. As the development of integrated circuits is constrained by the memory, area, power consumption, and function, the advanced packaging technology with chiplet heterogeneous integration at its core will be the key path and breakthrough for the development of integrated circuits. This paper reviews some advanced packaging technologies of milestone significance worldwide and presents the development status and advantages of advanced packaging in China. After that, it analyzes the gap between China and the world’s advanced level and put forward some suggestions for the development of China’s advanced packaging technology.