先进封装技术的发展与机遇
曹立强, 侯峰泽, 王启东, 刘丰满, 李君, 丁飞, 孙思维, 周云燕
Development and Opportunity of Advanced Packaging Technology
CAO Liqiang, HOU Fengze, WANG Qidong, LIU Fengman, LI Jun, DING Fei, SUN Siwei, ZHOU Yunyan
前瞻科技
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2022, (3): 101
-114
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DOI: 10.3981/j.issn.2097-0781.2022.03.009
